Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process

ABSTRACT

A method and system for universal packaging in conjunction with an automated in-line back-end IC manufacturing process. In one method embodiment, the present invention processes a die-strip through a number of integrated in-line processes that function independently of the die size of the die-strip. A control computer maintains a die-strip map database recording the die size of the die-strip. In-line molding and solder ball attachment processes are then performed and function independently of the die size of the die-strip. Processes that are independent of die size provide a universal packaging manufacturing solution. The present invention then accesses the database to determine the die size for cutting the die-strip based on specifications maintained by the electronic die-strip map database. Sorting, testing and finish assembly processes are then performed.

RELATED UNITED STATES APPLICATION

This application claims priority to the provisional U.S. patentapplication Ser. No. 60/272,283, entitled “Automated and/or IntegratedProcess and/or Equipment for Assembling, Packaging, Finishing, and/orTesting,” filed Feb. 27, 2001, and assigned to the assignee of thepresent application which is hereby incorporated by reference.

FIELD OF THE INVENTION

The present invention relates to the field of integrated circuit (IC)chip manufacturing. More particularly, embodiments of the presentinvention relate to a method of back-end manufacturing IC packaged chipsusing an integrated automated back-end IC manufacturing assembly.

BACKGROUND ART

Conventional back-end IC manufacturing facilities, at contract assemblyhouses as well as several original equipment manufacturers (OEMs), havea moderate to low level of automation and equipment integration. Theselines typically require several manual steps and depend upon operatorintervention for many, if not nearly all, operation, maintenance, lotmanagement and inspection steps. Since this is typically a batch typeprocess, there maybe a high level of work-in-progress (WIP) inventory,as well as relatively high cycle times. This type of factory managementmay not be suitable for manufacturing where flexibility is key, anddaily operation may require several changeovers in die, package andleadframe types.

Presently, the back-end manufacturing process for ICs (i.e. frommanufactured wafer to tested and packaged die) is labor intense. Inorder to manufacture an IC chip, in the back-end, from the initial stepof wafer reception to the packaging and shipping of the finished chip,there are many personnel and specialized pieces of equipment involved.Further, the process of back-end manufacturing an IC chip is arelatively long one. The complete process typically takes anywhere fromfour to six weeks to obtain a final packaged chip, and generally takeson the order of 1.5 to 2 weeks when using special “rush” or “hot lot”procedures.

Due to the length of the back-end manufacturing process and the requiredmanpower, IC chips are generally manufactured in batches. That is, theprocess of back-end manufacturing a single IC is done on a large scalewith individual large batches running through discrete process steps.This large scale is utilized to add a standard of efficiency to anotherwise complex process. For instance, a wafer that is received froman outside vendor is cut into strips. Each strip may containapproximately 200 die, and there may be 50 strips in a batch. Therefore,a typical batch of ICs, formed through a single back-end ICmanufacturing process, may contain 10,000 or more IC chips.

An embodiment of a conventional batch-oriented back-end IC manufacturingprocess is illustrated in FIG. 1. This embodiment illustrates the lengthof a conventional back-end IC manufacturing process. Batches of chipsmove from one stage of the process to the next. In block diagram 100,the back-end manufacturing line includes front-of-line portion 100A,end-of-line portion 100B, test 128, and finish portion 100C. Theback-end IC manufacturing process begins with die attach station (D/A)110. Although a die preparation process is required, this is typicallydone outside front-of-line portion 100A. Furthermore, the diepreparation process may take place in a different location than the restof the back-end IC manufacturing process.

Front-of-line portion 100A includes die attach station (D/A) 110, curestation 112, plasma treatment station 114, wire bond station (W/B) 116,and another plasma station 118 (typically a plasma cleaning station).This back-end IC manufacturing process includes many aspects whichrequire human material handling stations (HM) 150. HM 150 steps arerepresented in FIG. 1 with arrows. These HM 150 steps includetransferring the batch from one step of the process to the next, as wellas between specific manual visual inspection stations (MVI) 105.

In the front-of-line portion 100A, the cure station 112 may carry out acuring process in a machine designed to heat a batch of strips to atemperature of about 150 degrees Celsius, for a period of one hour, inorder to cure the glue used in the die attach step. This cure station112 is followed by a plasma station 114 cleaning step utilizing oxygen(O₂) or Argon (Ar). The next step is wire bond station (W/B) 116followed by MVI 105. Another plasma station 118 cleaning step is donefollowing wire bond station (W/B) 116 and another MVI 105. The plasmastation 118 cleaning step is similar to plasma station 114 cleaningstep, and each plasma step may last anywhere from 30 minutes to onehour.

With reference still to FIG. 1, back-end manufacturing line 100continues with an end-of-line portion 100B where need for humaninteraction also exists. End-of-line portion 100B begins with moldstation 120. HM 150 is utilized to move the batch through each MVI 105.The next step in end-of-line portion 100B is post mold cure station(PMC) 122. PMC 122 is a curing step which requires a temperature of175-degree Celsius and a timeframe of approximately 5 hours. After PMC122, the strip undergoes solder ball attach station (SBA) 124. FollowingSBA 124, MVI 105 takes place to ensure proper attachment of the ball toeach strip in the batch. The batch is then processed through saw station126. Saw station 126 separates the batch into individual IC chips. Thefinal step in end-of-line portion 100B is MVI 105 of the completed sawstation 126 step. Throughout the back-end manufacturing process, MVI 105normally includes additional quality control and assurance measures.

Following the completion of end-of-line portion 100B, back-end ICmanufacturing line 100 continues with test portion 128. In test portion128, as illustrated in the previous portions, the need for humaninteraction includes human handling during both the testing, andinspecting phases.

With reference still to FIG. 1, back-end IC manufacturing line 100further illustrates the final portion of the back-end IC manufacturingprocess. The final portion is illustrated as finish portion 100C. Finishportion 100C includes mark station 130, dry bake station 132, and tapeand reel station (T/R) 134. Most significantly, dry bake station 132 isa 24-hour dry bake step performed prior to T/R 134. Dry bake station 132is required by modern back-end IC manufacturing processes in order tomeet the stringent moisture sensitivity level (MSL) 3 IC chip packagingrequirements. Specifically, MSL 3 is a moisture level benchmark thatmeets demanding requirements placed on back-end IC manufacturers.

Therefore, in a typical back-end IC manufacturing line, a productioncycle may span a period of four to six weeks. Moreover, the processingcycle may be done at the batch level which results in approximately10,000 or more IC chips per stage. This batch level process results in alarge inventory of on hand IC chips. In an effort to control productionoverruns, a manufacturer will normally use a build-to-forecast modelbased on contract back-end IC manufacturing techniques.

Disadvantages of the batch level process include the large minimum ordersize and the long timeframe for the manufacture of a specific type ofIC. For example, if a customer requests an uncommon or highly demandedtype of IC, e.g., one that is not in inventory, they would typicallyplace a special order. In this case, a small order may not beeconomically worthwhile. Specifically, the batch level process isgenerally cost prohibitive unless the customer orders a specifiedminimum amount of product. Further, it generally takes a minimum of fourto six weeks to process a special order. Moreover, this minimum timeconventionally includes time to reset and/or maintain machinery, and/orinstruct inspectors on expected differences in the back-end ICmanufacturing process.

Another disadvantage of the conventional batch process is the multitudeof procedures using human interaction with the batch in transporting thebatch from stage to stage, or during certain stages, such as visualinspection (HM). These procedures include MVI, quality assurance (QA),and handling throughout the entire back-end IC manufacturing process.Specifically, MVI typically involves a pause in the back-end ICmanufacturing process so that an operator can manually inspect the ICchip after a given step. MVI is done to ensure correct part placement,proper IC shape, elimination of excess material on the IC, etc. MVI,however, is error prone because it relies on human judgment anddiscrimination, and it may be tedious, and may require sustained orprolonged concentration, thereby introducing difficult practice forperiods of time in excess of an hour or two, or over an entire workday.

Further, upon completion of the visual inspection, a QA examinationtakes place to ensure the MVI was done correctly. This QA examinationfurther delays the back-end IC manufacturing process due to an increasein overall time spent on the redundant inspection. Another detrimentalaspect of the MVI process is the human handling of the strips in thebatch. As an inspector analyzes a die on a strip in the batch, they mayinadvertently cause a defect. Thus, an inspector looking for defects mayactually be creating them.

A further problem arises in batch back-end IC manufacturing in that arelatively large number of personnel are required, e.g., personnel tomove the batch from point to point, personnel for MVIs, personnel for QAinspections, and personnel to operate each of the many processesrequired in typical IC back-end IC manufacturing. The average processingline may easily maintain a payroll of thirty-plus personnel. Therefore,the expense required per employee must be factored into the final costof the IC chip.

Early efforts in equipment integration and automation result in “islandsof automation” involving some automation at an individual equipmentlevel, but not a high level of multi-equipment integration. Individualoperation steps at the level of an individual piece of equipment hadbeen automated to some degree, but still manual inspection, as well asmanual lot movement and tracking remained typical. Further improvementsin equipment and software capabilities have transitioned these islandsto automation cells that handle large chunks of the assembly process.Each cell is a functional area and represents part of the totaloperation. However, a total solution has not been presented heretofore.

SUMMARY OF INVENTION

Thus, a need exists for a method and system for universal packaging inconjunction with a back-end IC manufacturing process. A further needexists for a method and system for universal packaging in conjunctionwith a back-end IC manufacturing process, which can proficiently performIC packaging on a smaller scale of chips. A further need exists for amethod and system for universal packaging in conjunction with a back-endIC manufacturing process which can abbreviate the MVI and QA processwhile maintaining a higher quality of visual inspection. Still anotherneed exists for a method and system for universal packaging inconjunction with a back-end IC manufacturing process which requiresfewer personnel to maintain a packaging line. A further need exists fora method and system for universal packaging in conjunction with aback-end IC manufacturing process which is compatible with existingback-end IC manufacturing processes.

One embodiment of the present invention advances factory automation byimplementing an advanced, fully integrated assembly and test linescapable of manufacturing ball grid array (BGA) packages (for example,molded BGA packages in a matrix array). The implementation hasintegrated the manufacturing process from die attach to tape and reel,with a reduced cycle time. This implementation enables a virtually“hands-free” production line with automated chip movement, testing,inspection and sorting as well as automated chip assembly.

The present invention provides, in various embodiments, methods tointegrate a IC chip manufacturing assembly. Embodiments of the presentinvention also provide an integrated in-line back-end IC manufacturingassembly process, which proficiently performs IC packaging manufacturingon a smaller scale. The present invention further provides a method andsystem for universal packaging in conjunction with a back-end ICmanufacturing process, which reduces the human-operated MVI and QAprocesses while maintaining a higher quality of visual inspection. Thepresent invention also provides a method and system for universalpackaging in conjunction with a back-end IC manufacturing process whichrequires fewer personnel on the manufacturing line. The presentinvention further provides a method and system for universal packagingin conjunction with a back-end IC manufacturing process, which iscompatible with existing back-end IC manufacturing processes.

Generally, an embodiment is directed to an integrated assembly processthat automatically moves small amounts of IC chips (e.g. a die strip)through packaging stages that span from receiving the IC dies to testingthe packaged chip and tape and reel assembly. Herein, the processing ofIC chips in a pipeline fashion is called “in-line” assembly because theindividual chips (in small amounts) are moved from station to stationvery rapidly and are not delayed in batch fashion. In-line assembly isdifferent from batch processing, in that, small amounts of chips movethrough the entire assembly process of the present invention (in apipeline fashion) from one end to another without interruption or delayassociated with batch processing. Handling, testing and processing thechips are also automated processes in accordance with the presentinvention to reduce and/or eliminate human interactions.

Specifically, in one embodiment, the present invention processes adie-strip through a number of integrated in-line processes that functionindependently of the die size of the die-strip. A control computermaintains a die-strip map database recording the die size of thedie-strip. In-line molding and solder ball attachment processes are thenperformed and function independently of the die size of the die-strip.Processes that are independent of die size provide a universal packagingmanufacturing solution. The present invention then accesses the databaseto determine the die size for cutting the die-strip based onspecifications maintained by the electronic die-strip map database.Sorting, testing and finish assembly processes are then performed.

In one embodiment, the various substations of the integrated in-lineback-end IC manufacturing hardware are arranged in an assembly lineformat. Further, a software process monitors and controls the integratedin-line back-end IC manufacturing hardware. It is also appreciated thatan automated reject management protocol is implemented from initial dieattach through test and finish. Specifically, the reject managementprotocol maintains a strip process history which is updated via anelectronic strip map database 620 throughout the manufacturing processusing comprehensive strip level tracking procedure. The updates to theelectronic strip map database 620 are received through a networkhierarchy including automated visual camera technology, integrated cellcontrollers, and an overall manufacturing execution system. Theseelements virtually eliminate human manual intervention in theinspecting, testing and sorting of IC chips.

In one embodiment, a universal packaging process is applied to thein-line assembly line manufacturing process. Specifically, universalpackaging utilizes the in-line subassemblies in conjunction with theintegrated software processes to increase throughput time of a specificpackage size. A further benefit is realized with the streamlinedtransition of subassembly manufacturing specifications from one packagesize to another. In general, aspects of universal packaging allowpackage changeovers with minimal changeover times, thus allowing someamount of flexibility within package families. For example, in oneembodiment, an exemplary changeover in the entire line from a 7 mm×7 mmpackage to any other package size may take less than thirty minutes.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and form a part ofthis specification, illustrate embodiments of the invention and,together with the description, serve to explain the principles of theinvention:

CONVENTIONAL ART FIG. 1 is a block diagram illustrating a conventionalbatch processed back-end IC manufacturing line.

FIG. 2 is a block diagram illustrating an exemplary integrated in-lineback-end IC manufacturing assembly line and assembly method inaccordance with one embodiment of the present invention.

FIG. 3A is a block diagram illustrating an exemplary front-of-lineportion of the novel integrated in-line back-end IC manufacturing lineand method in accordance with one embodiment of the present invention.

FIG. 3B is a block diagram illustrating an exemplary end-of-line portionof the novel integrated in-line back-end IC manufacturing line andmethod in accordance with one embodiment of the present invention.

FIG. 3C is a block diagram illustrating an exemplary finish portion ofthe novel integrated in-line back-end IC manufacturing line and methodin accordance with one embodiment of the present invention.

FIG. 4 is a block diagram illustrating an exemplary electronic die-stripmap database in accordance with one embodiment of the present invention.

FIG. 5 is a block diagram of an exemplary process of an electronicinspection and die-strip map database updating method in accordance withone embodiment of the present invention.

FIG. 6 is a block diagram of exemplary reject management system inaccordance with one embodiment of the present invention.

FIG. 7 is a block diagram illustrating an exemplary reject managementand sorting system in accordance with another embodiment of the presentinvention.

FIG. 8 is a flow chart of steps in an exemplary method for processing achip through integrated in-line back-end IC manufacturing hardware inaccordance with one embodiment of the present invention.

FIG. 9 is a flow chart of steps for software integration in accordancewith one embodiment of the present invention.

FIG. 10 is a flow chart of steps for reject management protocol used inconjunction with the in-line integrated in-line back-end ICmanufacturing assembly in accordance with one embodiment of the presentinvention.

FIG. 11 is a flow chart of steps in an exemplary method for universalpackaging in accordance with one embodiment of the present invention.

FIG. 12 is a block diagram of an exemplary general purpose computingsystem in accordance with one embodiment of the present invention.

FIG. 13 is a block diagram of an exemplary method of electronicinspection and strip map database updating in accordance with anotherembodiment of the present invention.

The drawings referred to in this description should be understood as notbeing drawn to scale except if specifically noted.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference will now be made in detail to the preferred embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings. While the invention will be described in conjunction with thepreferred embodiments, it will be understood that they are not intendedto limit the invention to these embodiments. On the contrary, theinvention is intended to cover alternatives, modifications andequivalents, which may be included within the spirit and scope of theinvention as defined by the appended claims. Furthermore, in thefollowing detailed description of the present invention, numerousspecific details are set forth in order to provide a thoroughunderstanding of the present invention. However, it will be obvious toone of ordinary skill in the art that the present invention may bepracticed without these specific details. In other instances, well-knownmethods, procedures, components, and circuits have not been described indetail as not to unnecessarily obscure aspects of the present invention.

Moreover, some portions of the detailed descriptions which follow arepresented in terms of procedures, logic blocks, processing and othersymbolic representations of operations for fabricating IC structures.These descriptions and representations are the means used by thoseskilled in the art of IC fabrication to most effectively convey thesubstance of their work to others skilled in the art. In the presentapplication, a procedure, logic block, process, or the like, isconceived to be a self-consistent sequence of steps or instructionsleading to a desired result.

It should be borne in mind, however, that all of these and similar termsare to be associated with the appropriate physical quantities and aremerely convenient labels applied to these quantities. Unlessspecifically stated otherwise, as apparent from the followingdiscussions, it is appreciated that throughout the present invention,discussions utilizing terms such as “establishing,” “coupling,”“monitoring,” and “utilizing,” or the like, refer to actions andprocesses (e.g. FIGS. 2-13) of back-end IC manufacturing.

OVERVIEW

Back-end IC manufacturing, in one example, refers to IC packaging andother assembly functions performed typically at or past “front-of-line”assembly time. This may include, “front-of-line” assembly, “end-of-line”assembly, “test”, and/or “finish” assembly.

Embodiments of the present invention concern an integrated,software-driven, in-line module for assembling, testing and/or finishingICs that, in one embodiment, contains multiple substations, e.g.,machines, from die attach through tape and reel (in one embodimenthaving a length of about 120 feet), connected with cell controllers to ahigher level manufacturing execution system (MES) and factory planninginformation. In effect, the system works like a singleassembly-test-finish equipment integrating all the individual processesinto one assembly step using software and hardware integration. All thisintegrated equipment allows a rapid package changeover with similarpackage size families, allowing flexibility in production capabilities.

The present embodiment advantageously uses automated strip conveyorsystems and robotic arms. In one embodiment, there is no human handlingof substrate strips or IC units at all, and all human inspection, eitheroffline or online, may be replaced with machine auto-vision. In additionto better inspection quality, machine auto vision also allows qualityassurance (QA) simultaneously with production. The present embodimentsimplifies the overall assembly process by eliminating offline processesand/or reducing in-line batch processes like curing, plating, and drybaking (e.g. converting such batch processes to continuous processes).

In one embodiment, the exemplary platform package may be a matrix array“die-strip” (e.g. an n-by-m matrix array of die on a single substrate,where n and m are each independently an integer of ≧2 preferably from 3to 15, more preferably from 4 to 10) molded ball grid array (BGA)package. Array-based package-independent processing lends itself to thegoals of automation and integration.

INTEGRATED HARDWARE

In the following discussion, FIGS. 2-8 illustrate the hardwareintegration process of the present embodiment broken into four assemblyportions. Including front-of-line, end-of line, test, and finish.

FIG. 2 is a block diagram illustrating an integrated in-line back-end ICmanufacturing assembly (process) 200 in accordance with one embodimentof the present invention. FIG. 2 begins with the die attach (D/A)substation 304 that performs the D/A process and ends with tape and reelassembly 328. Any die preparation processes may be used with the presentembodiment.

FIGS. 3A-3C are block diagrams illustrating more detailed versions ofline 200 of FIG. 2. Specifically, FIG. 3A is front-of-line assemblyportion 300A, FIG. 3B is end-of-line assembly portion 300B, and FIG. 3Cis finish assembly portion 300C.

FIG. 8 is a flow diagram for illustrating pertinent process stepsassociated with line 200. With reference now to step 802 of FIG. 8 andto FIG. 3A, the present embodiment processes die-strip 400 throughfront-of-line assembly portion 300A. As described above, theimplementation of a single die-strip 400 traveling through line 200,allows for a more personal approach to the manufacturing process.Specifically, since only a single die-strip 400 is processed througheach substation, an order may be placed for a number of IC chips whichis smaller than the conventional art batch size without ensuing theextraordinary costs previously associated with a small run. It is alsorelevant that the difference in size between a single die-strip 400 anda batch containing 50 or so die-strips, enables smaller more efficientmachinery to be utilized during line 200. In general, the presentembodiment processes die-strip 400 individually in an in-line fashion.Therefore, the batch process used by the conventional art is removedfrom the integrated in-line back-end IC manufacturing method of thepresent embodiment.

Now, with reference to step 802 of FIG. 8 and FIG. 3A, the front-of-lineassembly portion 300A comprises a plurality of sub-stations operating onan in-line basis. In one embodiment, the plurality of sub-stationsinclude die attach substation (D/A) 304, cure substation 306, plasmasubstation 308, wire bond substation (W/B) 310, and plasma substation312. In the present embodiment, many portions of the conventional lineprocess have been modified in order to establish an in-line assemblyline format.

Front-of-line portion 300A receives a die-strip (an example of adie-strip 400 is illustrated in FIG. 4) at the die attach substation 304that performs the die attach (D/A) process. However, the actual cuttingand shaping of the wafer, from which die-strip 400 is formed, may takeplace outside of the scope of the present embodiment.

Substation 304 performs the initial processes of attaching die to astrip thereby forming a die-strip 400. Specifically, D/A substation 304attaches a die (for example, a BGA die) to die strip 400 (FIG. 4). Inthe present embodiment glue is used to attach die to die strip 400. Theglue may be any glue utilized by one skilled in the art. It isappreciated that any well-known die preparation process may be used withthe present embodiment.

The second step in front-of-line assembly portion 300A is performed bycure substation 306 that performs the cure process. In general, curesubstation 306 performs an in-line process for drying the adhesivebetween die and substrate used in D/A substation 304. That is, die strip400 remains at cure substation 306 until the glue is cured and die isfixedly coupled to die strip 400. The third step is plasma substation308 that performs a plasma process. Specifically, plasma substation 308performs an in-line cleaning substation that is applied to both sides ofdie strip 400 in order to clean any excess glue from die and die strip400. In general, in-line plasma substation 308 may utilize any number ofwell-known cleaning processes.

The forth step in front-of-line assembly portion 300A is performed atW/B substation 310. W/B substation 310 performs an in-line process forwire bonding die strip 400. The final step in front-of-line assembly300A is performed by plasma substation 312. Plasma substation 312performs an in-line cleaning process applied to both sides of die strip400 in order to dean any excess wire bonding material from die strip400.

With further reference to step 802 of FIG. 8 and FIG. 3A, the presentembodiment reduces most processing times established by the sub-stagesof the conventional art. For instance, in the present embodiment, cureprocess and substation 306 is a snap cure which takes approximately 2minutes. In addition, both plasma cleaning processes and substations(e.g. plasma substation 308 and plasma substation 312) have been reducedin length to approximately one minute. The reductions in processing timeare a result of both the reduced processing size and in-line nature ofthe present embodiment. That is, since the present embodiment is appliedat a die-strip 400 level and since each die-strip 400 is maintained in acontrolled environment, many time consuming steps of the conventionalart batch process have been reduced. Specifically, the internal areas ofthe in-line processing stations are reduced significantly. Thisreduction results in less time required for heating, venting, vacuuming,etc. Further, with no need for human interaction, the processingenvironment may be maintained at peak proficiency.

With further reference to step 802 of FIG. 8 and FIG. 3A, in the presentembodiment human handling situations have been removed. This removal ofhuman interaction is obtained by the implementation of specificmanufacturing aspects. The first aspect is the integration of thehardware. Specifically, the integration of an in-line assembly processresults in automated movement of die-strip 400 from one process to thenext. The second aspect is the introduction of vision camera systems(V/C) 302 at D/A substation 304 and W/B substation 310. Specifically,V/C 302 assumes all aspects of the inspection and QA requirementspreviously performed by hand. Further details of V/C 302 are covered inthe software process outlined herein.

With reference now to step 804 of FIG. 8 and FIG. 2, the presentembodiment automatically, in an in-line fashion, provides die-strip 400from the front-of-line assembly portion 300A to an end-of-line assemblyportion 300B. Analogous to the front-of-line assembly portion 300A, theend-of-line assembly portion 300B contains many in-line substations.Also, as illustrated in the previous front-of-line assembly portion300A, need for human interaction within the manufacturing process iseliminated.

With reference now to step 806 of FIG. 8 and FIG. 3B, the presentembodiment processes die-strip 400 through the end-of-line assemblyportion 300B having a plurality of sub-stations operating on an in-linebasis. In one embodiment, the plurality of sub-stations in end-of-lineassembly portion 300B include mold substation 314, post mold cure (PMC)substation 316, solder ball attach (SBA) substation 318, saw substation320, and sort substation 322.

The first process in end-of-line assembly portion 300B is performed atthe mold substation 314. In general, mold substation 314 utilizes amolding compound injection. Specifically, mold substation 314 is anin-line process that places a protective layer of material above diestrip 400. In the present embodiment mold substation 314 may be aplastic or any other type of non-conductive material which can act as alayer of protection.

The second step in end-of-line assembly portion 300B is performed by thePMC substation 316. In general, PMC substation 316 performs an in-lineprocess for drying the non-conductive material used at mold substation314. That is, die strip 400 remains at PMC substation 316 until themolding material is cured, thereby ensuring that die is protectivelycovered on die strip 400.

The third step in end-of-line assembly portion 300B is performed at theSBA substation 318. Specifically, SBA substation 318 performs an in-lineprocess for attaching a solder ball to die strip 400. The forth step inend-of-line assembly portion 300B is performed at the saw substation320. Saw substation 320 performs an in-line process for cutting diestrip 400. Specifically, saw substation 320 cuts die strip 400 intosingle components each containing a die portion.

The final step in end-of-line assembly portion 300B is performed at thesort substation 322. Sort substation 322 performs an in-line sortingprocess applied to each component cut from die strip 400. In general,sort substation 322 is used for separating e.g., categorizing,individual die components into accepted and rejected piles. Thespecifics of saw substation 320 and sort substation 322 are discussed inmore detail herein. At the completion of end-of-line portion 300B, diecomponents are provided to the tester substation 330 (FIG. 2).

With further reference to step 806 of FIG. 8 and FIG. 3B, the presentembodiment both reduces and modifies most processes and timesestablished by the conventional art, thereby allowing an efficientin-line assembly to be performed. Of particular significance, PMCsubstation 316 has been integrated into in-line back-end ICmanufacturing line 200. Not only has PMC substation 316 been integratedinto the manufacturing methodology of the present embodiment, it is usedto accomplish both PMC 122 and dry bake 132 of the conventional art.Additionally, PMC substation 316 includes an annealing portion (e.g. forapprox. 20 minutes) to reduce strip warpage and allow mechanical stressrelief. Therefore, in the present embodiment, upon completion of a 175degree Celsius, 5 hour PMC substation 316, die strip 400 does notrequire a dry bake 132. Although dry bake 132 has been removed, theresulting components are nevertheless packaged at moisture sensitivitylevel 3 (MSL 3). Specifically, the ability to remove dry bake 132 is dueto the extremely short cycle time of line 200 following PMC substation316. In fact, the removal of dry bake 132 advantageously reduces line200s timeline by at least 24 hours.

Referring still to step 806 of FIG. 8 and FIG. 3B, the presentembodiment establishes new methods for saw substation 320. Generallyspeaking, conventional saw machines were designed for 8″ wafer sawing.However, the present embodiment employs n-by-m matrix array strips.Therefore, the substrate cutting length on the saw is modified (in oneembodiment, to 205 mm). In another embodiment, the package sawingmachine may be enhanced to allow tape-less singulation (sawing) ofmolded strips with a length of more than 230 mn. The presentmodifications achieve a higher unit density, thereby increasing thethroughput of the line.

It is appreciated that V/C systems 302 are employed by the end-of-lineportion 300B at the mold 314, SBA 318, and sort 322 substations. Theinteraction of these systems is described further to follow.

With reference now to step 808 of FIG. 8 and FIG. 2, the presentembodiment automatically provides die-strip components 400 fromend-of-line assembly portion 300B to a test assembly portion 330 usingan in-line fashion.

With reference now to step 810 of FIG. 8 and FIG. 2, die-stripcomponents 400 are electronically tested using test assembly portion330. In general, test assembly portion 330 is a quality assurancemeasure wherein specific components are tested to ensure properoperation. Specifically, test assembly portion 330 can be used toidentify a good or bad die. It may further be utilized to subdivide gooddie based on performance characteristics such as speed, thermodynamicvalues, etc. As previously stated, this is accomplished in an automatedin-line fashion.

With reference now to step 812 of FIG. 8 and FIG. 2, the presentembodiment automatically provides die-strip components 400 from testassembly portion 330 to a finish assembly portion 300C. As illustratedin the previous portions (e.g. 300A and 300B) the need for humaninteraction within the manufacturing process has been eliminated.

With reference now to step 814 of FIG. 8 and FIG. 3C, the presentembodiment processes die-strip components 400 through the finishassembly portion 300C, which comprises a plurality of sub-stationsoperating on an in-line basis. In one embodiment, the plurality ofsub-stations in finish portion 300C include mark substation 324, finalvisual inspection (FVI) substation 326, and tape and reel (T/R)substation 328.

In general, in-line finish portion 300C performs the final processes tothe components of die strip 400. The first process of in-line finishassembly portion 300C (e.g. performed by mark substation 324) marks thecomponents cut from die strip 400. In the present embodiment the mark isan identifying characteristic enabling the components cut from die strip400 to be grouped into lots. The mark is aided by a visual inspectionsystem (e.g. V/C 302) and may further contain a company logo, or anyother information the manufacturer may desire.

The second step in in-line finish portion 300C is performed by the FVIsubstation 326. In general, FVI substation 326 performs an in-lineprocess for performing the final visual inspection on die strip 400components. That is, components of die strip 400 are visually inspectedfor many technical aspects. A few inspection requirements includeassurance that components are complete, that all parts are properlyprotected, that the sawing process was completed correctly, etc. In thepresent embodiment, FVI substation 326 is performed using the aid of anin-line automated visual camera (V/C) 302.

The final step in in-line finish portion 300C is performed by T/Rsubstation 328. T/R substation 328 performs an in-line process forpackaging the components cut from die strip 400. T/R substation 328 iscovered in more detail in the universal packaging section herein anduses a visual inspection system V/C 302.

In the finish assembly portion 300C, the 24-hour dry bake process of theconventional art has been removed completely. In its place, final visualinspection (FVI) substation 326 occurs. FVI substation 326 utilizes V/C302 and the integrated software processes of line 200 to inspect thefinished components prior to packaging. In one embodiment, packaging isreferred to as tape and reel (T/R) substation 328 which places theindividual IC chip components into compartments which are taped togetherand then reeled. The above-mentioned, V/C 302 and integrated softwareprocesses will be covered in more detail herein.

It is appreciated that embodiments of the present invention utilize anumber of automated carriers or conveyors to move die-strips anddie-strip components from one substation to another. These conveyors,and the substations themselves, are controlled by a central softwareapplication of a computer control system.

With reference still to FIG. 2, the present embodiment has reduced theoverall processing time of a die strip 400 by using a completely in-linetechnique without human interaction. Specifically, in the conventionalart, a production cycle spanned a period of four to six weeks. In thepresent embodiment, a production cycle takes approximately one day fromD/A substation 304 to T/R substation 328. Further, the processing cycleresults in an average of 3,600 units per hour for a 48-pin package. Thesignificant increase in productivity is due to a new die-strip 400 nothaving to wait for a previous die-strip 400 to finish an entireprocessing cycle. In fact, a new die-strip 400 may enter line 200 inpipeline fashion, e.g., as soon as the previous die-strip 400 hascleared the initial processing step. Therefore, line 200 maintains anefficient, made-to-order process with die-strips being pipelined throughthe in-line assembly process. The present embodiment further results inlower labor costs and reduced personnel requirements due to theautomation of the assembly line method.

INTEGRATED SOFTWARE PROCESS

With reference now to FIG. 12, portions of the present embodiment arecomprised of or controlled by computer-readable and computer-executableinstructions which reside, for example, in computer-usable media of acomputer control system. FIG. 12 illustrates an exemplary computersystem 1212 that may be used in accordance with one embodiment of thepresent invention. It is appreciated that system 1212 of FIG. 12 isexemplary only and that the present embodiment can operate on or within,or be controlled by, a number of different computer systems includinggeneral purpose networked computer systems, embedded computer systems,routers, switches, server devices, client devices, various intermediatedevices/nodes, stand alone computer systems, and the like. Additionally,computer system 1212 of FIG. 12 is well adapted having computer readablemedia such as, for example, a floppy disk, a compact disc, and the likecoupled thereto.

System 1212 of FIG. 12 includes an address/data bus 1210 forcommunicating information, and a central processor unit 1201 coupled tobus 1210 for processing information and instructions. System 1212 alsoincludes data storage features such as a computer usable volatile memory1202, e.g. random access memory (RAM), coupled to bus 1210 for storinginformation and instructions for central processor unit 1201, computerusable non-volatile memory 1203, e.g. read only memory (ROM), coupled tobus 1210 for storing static information and instructions for the centralprocessor unit 1201, and a data storage device 1204 (e.g., a magnetic oroptical disk and disk drive) coupled to bus 1210 for storing informationand instructions. System 1212 of the present embodiment also includes anoptional alphanumeric input device 1206 including alphanumeric andfunction keys coupled to bus 1210 for communicating information andcommand selections to central processor unit 1201. System 1212 alsooptionally includes an optional cursor control device 1207 coupled tobus 1210 for communicating user input information and command selectionsto central processor unit 1201. System 1212 of the present embodimentalso includes an optional display device 1205 coupled to bus 1210 fordisplaying information.

With reference now to process 900 of FIG. 9, the present embodimentimplements a software process 900 in conjunction with assembly line 200.In one embodiment, the software process 900 takes place on computercontrol system 1212.

With reference now to step 902 of FIG. 9 and FIG. 6, a communicationsprotocol is utilized between system 1212 and the in-line substations tocontrol their activity. Specifically, a standard semi equipmentcommunications standard/generic equipment model (SECS/GEM) protocol maybe used. Generally speaking, SECS is a layer 6 protocol that describesthe content of the messages while GEM is a higher layer applicationprotocol that defines the messages themselves.

With reference still to step 902 of FIG. 9 and FIG. 6, thecommunications protocol is utilized to provide an interface betweenportions of the integrated in-line back-end IC manufacturing hardware200. In another embodiment, the communications protocol may beestablished within each piece of hardware on line 200. As shown in FIG.6, the communications protocol results in a software hierarchy for line200. In another embodiment, the software hierarchy is established tomaintain overall control of line 200. Further, the communicationsprotocol is independent of the hardware platform. Thus, compatiblecommunication between any portion of line 200 is obtained.

With reference now to step 904 of FIG. 9 and FIG. 6, the presentembodiment monitors a portion of line 200 using a manufacturingexecution system (MES) 600 coupled with the communications protocol.Furthermore, MES 600 may be comprised of at least one equipment cellcontroller (CC). In the present embodiment, MES 600 may also becomprised of two CCs. Specifically, a portion of front-of-line hardware300A is coupled with front-of-line equipment cell controllers (CC) 602,and a portion of end-of-line hardware 300B is coupled with end-of-lineequipment CC 604. Both CC 602 and CC 604 are then coupled to communicatewith MES 600 for command and control. In one embodiment, MES 600maintains a planning database 620 which includes a die-strip mapdatabase. In another embodiment, MES 600 controls the processingactivities at each substation. Accordingly, all lot movement andprocess-monitoring details are regularly updated to MES 600 andultimately the planning database 620 via both CC 602 and CC 604. Inanother embodiment, planning database 620 is further utilized tomaintain an internal planning and/or order/shipment database. However,in order to maintain comprehensive tracking of lot movement andprocess-monitoring details, a system to differentiate each die-strip 400is instituted. The specifics of the system to differentiate eachdie-strip 400 will be discussed in detail herein.

A further example of multiple embodiments of the software hierarchy isillustrated in FIG. 13. Specifically, FIG. 13 is a representation of thesteps taken by the visual system, e.g., V/C 302, to view the die-strip400. The results of their inspections are collected by CC 602 and CC 604units and are then transferred to the central MES 600 system. In oneembodiment, the inspection results are further transferred to database620. In general the three columns (e.g. die-strips i, i+1, and i+2)represent portions of a die-strip 400 die map. Specifically, boxes F1-F8represent mapping, while E1-E4 represent other parameters collected atother visual stations. All boxes represent process history informationincluding individual die-strip map database (e.g. 620) and inspection(e.g. quality assurance (QA) 1 1310 and QA2 1320. As stated herein, alldata collected by V/C 302 systems is stored in a database that maintainseach die-strip 400s' processing history. Although a specific hierarchyof computer systems is established, the present embodiment is wellsuited to many types of computer system hierarchy. Additionally, thepresent embodiment of computer system hierarchy is illustrated forpurposes of clarity, not as a means of limitation.

REJECT MANAGEMENT

In one embodiment, reject management is a portion of the in-lineassembly line manufacturing process that utilizes the integratedsoftware processes mentioned herein to determine the manufacturingstatus, quality, and performance of each specific die on a die-strip400. In general, aspects of reject management detailed herein allowcomprehensive tracking and quality assurance of a die-strip 400 andevery die thereon ensuring a high level of “out-the-door” productquality. Reject management is dependent on accurate V/C 302 calibrationand integration with the software database 620.

With reference now to step 1002 of FIG. 10 and FIG. 5, the presentembodiment implements an automated and database driven tracking processfor die-strip 400 which uses the camera vision systems to automaticallyidentify individual die-strips 400 and their respective locations asthey traverse through the in-line assembly line 200. In one embodiment,the tracking process starts at die attach substation 304 and ismaintained throughout the entire back-end IC manufacturing process.However, in order to maintain a die-strip level tracking process, atwo-dimensional code, known as data matrix 2D symbol 510 may be placedon every die-strip 400. In one embodiment, data matrix 2D symbol 510 isetched onto die-strip 400 by a laser. However any printing or affixingmethod could be used.

Specifically, each data matrix 2D symbol 510 utilizes a specialized 2Dmatrix code similar to a bar code. Data matrix 2D symbol 510 may storeup to 19 characters, in one embodiment, which maintain all specific chipand lot related information. Further, a second data matrix 2D symbol 510may also be placed on die-strip 400. This second data matrix 2D symbol510 is analogous to the first data matrix 2D symbol 510 and may beutilized as a back up. Therefore, if any damage occurs to the first datamatrix 2D symbol 510, the die-strip tracking process remains possible byutilizing back-up data matrix 2D symbol 510. In a second case, acombination of both first data matrix 2D symbol 510 and back-up datamatrix 2D symbol 510 may be used for tracking recognition purposes.

With reference now to step 1004 of FIG. 10 and FIG. 6, the presentembodiment accesses an electronic die-strip map database 620 thatprovides parameter storage for each individual IC component within eachdie-strip 400. In one embodiment, the electronic die-strip map database620 is located in memory on MES 600. In general, the electronicdie-strip map database 620 maintains a record of each die-strip 400traversing the individual substations of the manufacturing process.Specifically, the electronic die-strip map database 620 maintainsinformation relative to the die-strip level as well as informationregarding inspection and processing at the individual die level.

An example of the electronic die-strip map database 620 is illustratedin FIG. 4. Specifically, a single die-strip 400 is shown in a visualrepresentation of the electronic die-strip map database 620. Thedatabase 620 records parameters for each chip on the die-strip 400 andthese parameters are updated as the die strip traverses through themanufacturing process thereby providing a process history for thedie-strip 400. For instance, 164 individual die are illustrated on amatrix substrate, or leadframe, in an array-like structure on die-strip400. On each die a representative letter is shown as a parameter withina designated die block. In one embodiment, the letter is either a G or aB. Specifically, G is a reference to good, while B is a reference tobad.

During the manufacturing process, any changes to the status of aspecific die are updated by the electronic die-strip map database 620. Anegative update to the strip map would result in a change on die-strip400 from a die block being designated with a G to a new designation ofB. The designations of G and B are simplified examples of an actualelectronic die-strip map database 620. Further, any representationresulting in differentiation between satisfactory and unsatisfactory dielocated on die-strip 400 may be utilized by the present embodiment. Afurther example of differentiation is the parameter of test speed. Forinstance, the die-strip map database 620 could also categorize die basedon performance data, such as speed, etc.

With reference now to step 1006 of FIG. 10 and FIG. 5, the presentembodiment utilizes the tracking process to update the electronicdie-strip map database 620 at each substation that collects parameterinformation throughout the manufacturing process. Specifically,die-strip 400 is analyzed at each key process by V/C 302. In oneembodiment, V/C 302 is used to inspect a portion of the die on die-strip400 for physical attributes. Parameters are then updated for each die inthe database 620. In another embodiment, V/C 302 is used as a datamatrix 2D symbol 510 reader for location determination by identifyingthe die-strip 400. For example, the analysis of die-strip 400 in afront-of-line portion 300A is conducted by V/C 302. Further, the datamatrix 2D symbol 510 on the same die-strip 400 is read by V/C 302. Theresults of both V/C 302 processes are reported to CC 602. CC 602 thenpasses the information to the electronic die-strip map database 620located on MES 600. This information is then processed by the electronicdie-strip map database 620. In so doing, the updated electronicdie-strip map database 620 will continue to maintain a positive track ofa portion of the die on die-strip 400.

Although in the present embodiment V/C 302 are used as a data matrix 2Dsymbol 510 reader, a distinct 2D code reader may be installed at thestrip entry point of a substation of processing equipment that willupdate and/or use the strip map database 620. The utilization of V/C 302as the 2D code reader and die-strip 400 inspector are merely forpurposes of brevity. It is further appreciated that each automated V/C302 may be independent from, or in electronic communication with, any orall other automated V/C 302.

With reference still to step 1006 of FIG. 10 and FIG. 5, in the presentembodiment V/C 302, the tracking process, and the electronic die-stripmap database 620 are the tools that have improved the tracking,inspecting, and dehumanization of the back-end IC manufacturing process.Specifically, the reliability of V/C 302 in the electronic die-stripmapping process is important. V/C 302 is utilized for data matrix 2Dsymbol 510 reading and verification. For example, V/C 302 automaticallyrecognizes the die-strip 400 by reading the data matrix 2D symbol 510 atdifferent points throughout the in-line manufacturing process. V/C 302is further used for visually inspecting die-strip 400 and the diethereon throughout the in-line manufacturing process. Specifically, thepresent embodiment uses V/C 302 inspection after some of the majorprocess steps, for example, die attach substation 304, W/B substation310, mold substation 314, SBA substation 318, and saw substation 320. Inanother embodiment, V/C 302 inspection is used after all of the majorprocess steps. Accordingly, utilizing V/C 302 for both inspection ofdie-strip 400 and a portion of the die on die-strip 400, as previouslystated, allows the present embodiment to replace human inspectors withautomated inspection techniques. As a result, completion times of thein-line assembly line process are markedly improved.

There are many reasons why automated inspection is preferred to humaninspection. A major reason is the quantity of inspection capabilities.In the conventional process, initial human inspection is conducted on aportion of the batch. Each initial human inspection is then followed bya human QA inspection of a smaller portion of the same batch. Thisredundancy is established to ensure a quality product. However, in oneembodiment of the present invention, all of the die on each die-strip400 may be inspected. Thus, a complete inspection capability isobtained. Such a capability allows for higher product reliability.

A second reason for automation is the specific inspection method. Inhuman inspection, each inspector brings a personality to the inspectionprocess. Further, the inspection station has rotating personnel.Therefore, the inspection techniques differ per inspector. In anautomated inspection process, no personality is involved and V/C 302 isin constant operation. Further, each V/C 302 is calibrated and all V/C302 maintain a similar standard for inspection.

A third reason for automation over human inspection is the contactfactor. For example, when a human inspects a batch, purposeful orincidental contact of either die-strip 400 or a die thereon may occurduring the inspection process. With an automated inspection system,there is no need for V/C 302 to make any sort of contact with die-strip400 or any die thereon. Thus, all incidental damage caused by theinspector or the inspection is removed.

Therefore, it is appreciated that each of the preceding aspects ofautomated inspection result in an increase in productivity.Additionally, an increase in quality and quantity of product is realizeddue to better inspection practices. A further benefit is the reductionof collateral damage due to the removal of any incidental human contact.

With reference now to step 1008 of FIG. 10 and FIG. 6, the presentembodiment categorizes the die on die-strip 400 based on informationmaintained by the electronic die-strip map database 620. Specifically,the electronic die-strip map is continuously updated at each inspectionstep, on the die-strip map server by V/C 302. Thus, the electronicdie-strip map database 620 maintains the complete processing history ofdie-strip 400. This map database 620 can then be used to physicallyseparate die into bins of similar categories.

Therefore, with reference to FIGS. 6 and 7, when die-strip 400 reachessaw substation 320 and sort substation 322, the electronic die-trip mapis downloaded and the information is used to automatically sort andreject the designated “bad” units. Sorting may be performed based on anymanaged parameters. Specifically, the reject management protocolsutilize the electronic die-strip map database 620 categories and eitheraccept or reject each die. In another embodiment, subsequent rejectionprocesses take place following the testing, marking, and final visualinspection steps of the integrated in-line IC assembly method. At eachrejection evaluation, accepted units continue the process while anyrejected units are automatically placed in reject bins 610. Further, itis possible for the electronic die-strip map database 620 to isolatespecific rejected units on die-strip 400 early in the in-linemanufacturing process such that no further back-end IC manufacturingprocesses are performed on the rejected units. In fact, rejectedcomponents, which are identified early in the manufacturing process,remain in their rejected state on die-strip 400 until reaching sortsubstation 322. At that point, all rejected units are deposited inreject bins 610. Thus, valuable manufacturing materials are saved foruse on accepted units. In one embodiment, when a unit has passed allrequired evaluations and completed the tape and reel substation 328 ofthe in-line assembly process, the reel is then placed in a good bin 710.

With reference still to step 1008 of FIG. 10, the present embodimentfurther utilizes the electronic die-strip map database 620 to establisha processing history for tracking material usage and equipment details,and preventing the mixing of chips. Another added benefit of having aprocessing history, are the improved defect analysis features.Specifically, the processing history may be used to isolate exact areaswithin die-strip 400 or a substation of the integrated in-line back-endIC manufacturing process correlated with recurring defects. Thus, it isthen possible to establish preventive maintenance techniques, such as,statistical process control (SPC) which predict and identify/repairthese defective zones thereby increasing productivity.

UNIVERSAL PACKAGING

In one embodiment, universal packaging is a portion of the in-lineassembly line manufacturing process which utilizes updated subassembliesmentioned herein in accordance with the integrated software processesdisclosed. In general, aspects of universal packaging detailed hereinallow package changeovers with minimal changeover times, thus allowingsome amount of flexibility within package families. For example, anexemplary changeover in the entire line from a 7 mm×7 mm package to anyother package size may take less than thirty minutes.

With reference now to step 1102 of FIG. 11 and FIG. 6, an electronicdie-strip map database 620 is accessed. Specifically, mold 314 ofportion 300B is established as the introductory point, in process 650,for the universal packaging process. As stated above, mold 314 is thestep in the back-end IC manufacturing process wherein the die abovedie-strip 400 is covered in a protective coating. In one embodiment, theprotective coating is a type of plastic. Moreover, the protectivecoating is placed in a specific location on die-strip 400. That isindependent of any actual die shape. In fact, mold 314 is a standardprocess applied to each die-strip 400. As such, there is no need formodification of mold 314 process per specific die size run. Thus, anymechanical or manufacturing modifications required by mold 314 arereduced. Specifically, as long as the size of die-strip 400 remainsconstant, the size of the die on die-strip 400 is immaterial. Inaddition, die-strip 400 may utilize either plastic or copper as thestrip portion for die attachment without any detrimental effects.

With further reference to process 1102 of FIG. 11 and FIG. 6, theintegrated solder ball attach (SBA) substation 318 process is alsouniversal. That is, in the present embodiment, SBA substation 318process is independent of solder ball type. The specific choice isrelated to outside manufacturing costs and desired integrated chiprequirements. In general, the integrated in-line back-end ICmanufacturing process SBA substation 318 is similar in process to mold314. That is, SBA substation 318 is also used at die-strip 400 level.Therefore, no matter what size die is above die-strip 400, SBAsubstation 318 uses the same universal attachment method. Because of theuniversality of SBA substation 318, there is no need to retool SBAsubstation 318 in order to process a different size die as long asdie-strip 400 remains constant.

With reference now to step 1104 of FIG. 11 and FIG. 6, die-strip 400 isautomatically cut based on information maintained by the electronicdie-strip map database 620. Specifically, due to the universality ofboth mold 314 and SBA 318 substations, die-strip 400 arrives at sawsubstation 320 in a uniform format. Saw substation 320 then requiresspecific instructions about the die specifications in order to cutdie-strip 400 without damaging any individual die thereon. Specifically,saw substation 320 is informed of the specific cutting specifications bythe electronic strip-map database 620. As stated above, the electronicstrip-map database 620 maintains the complete strip processing historyof die-strip 400. Hence, when saw substation 320 receives the cuttingspecifications, it is able to cut die-strip 400 into the specifiedcomponents without any human interaction while maintaining theintegrated assembly line back-end IC manufacturing format. The resultingcut die components are then individually packaged at T/R substation 328using, in one embodiment, the industry standard quad flat packaging withno lead (QFN).

Thus, the present invention provides, in various embodiments, a methodand system for universal packaging in conjunction with a back-end ICmanufacturing process. Embodiments of the present invention also includea method and system for universal packaging in conjunction with aback-end IC manufacturing process which can proficiently perform ICpackaging in an in-line fashion. The present invention further providesa method and system for universal packaging in conjunction with aback-end IC manufacturing process which can curtail human visualinspection and QA process by using automated vision systems to maintaina higher quality of visual inspection. The present invention alsoprovides a method and system for universal packaging in conjunction witha back-end IC manufacturing process which requires fewer personnel tomaintain a packaging line. The present invention further provides amethod and system for universal packaging in conjunction with a back-endIC manufacturing process which is compatible with existing back-end ICmanufacturing processes.

The foregoing descriptions of specific embodiments of the presentinvention have been presented for purposes of illustration anddescription. They are not intended to be exhaustive or to limit theinvention to the precise forms disclosed, and obviously manymodifications and variations are possible in light of the aboveteaching. The embodiments were chosen and described in order to bestexplain the principles of the invention and its practical application,to thereby enable others skilled in the art to best utilize theinvention and various embodiments with various modifications are suitedto the particular use contemplated. It is intended that the scope of theinvention be defined by the Claims appended hereto and theirequivalents.

What is claimed is:
 1. A method for universal packaging in a back-end ICmanufacturing process comprising: traversing a die-strip through afront-of-line portion of said back-end manufacturing process and a partof an end-of line portion of said back-end manufacturing process,wherein said front-of-line portion and said part of said end-of-lineportion function independently of the die size of said die-strip;accessing an electronic die-strip database stored in a computer systemto determine said die size of said die-strip; and based on said diesize, cutting said die-strip into individual devices.
 2. A method asdescribed in claim 1 further comprising sorting said individual devices,wherein said sorting is dependent on said die size.
 3. A method asdescribed in claim 1 comprising controlling said front-of-line portion,said part of said end-of line portion, said cutting and said sortingusing said computer system.
 4. A method as described in claim 1 whereinsaid part of said end-of-line portion comprises an automated in-linemolding process and wherein said traversing comprises processing saiddie-strip through said automated in-line molding process that functionsindependently of said die size.
 5. A method as described in claim 4wherein said part of said end-of-line portion further comprises anautomated in-line ball attachment process and wherein said traversingfurther comprises processing said die-strip through said automatedin-line ball attachment process that functions independently of said diesize.
 6. A method as described in claim 5 wherein said in-line ballattachment process is utilized on both plastic and copper.
 7. A methodas described in claim 1 wherein said cutting is performed using anintegrated in-line sawing process of said end-of-line portion.
 8. Amethod as described in claim 1 wherein said front-of-line portioncomprises an in-line die-attachment process; an in-line cure process; afirst in-line plamsa process; an in-line bond process; and a secondin-line plasma process and wherein said traversing comprises: processingsaid die-strip through said in-line die-attachment process thatfunctions independently of said die size; processing said die-stripthrough said in-line cure process that functions independently of saiddie size; processing said die-strip through said first in-line plasmaprocess that functions independently of said die size; processing saiddie-strip through said in-line bond process that functions independentlyof said die size; and processing said die-strip through said secondin-line plasma process that functions independently of said die size. 9.A method as described in claim 1 further comprising traversing saidindividual devices through a test process and a finish assemblyprocesses which produce taped and reeled products.
 10. A method foruniversal packaging in a back-end IC manufacturing process comprising:traversing a die-strip through a front-of-line portion of said back-endmanufacturing process, a mold process and a ball attachment process,wherein said front-of-line portion, said mold process and said ballattachment process all function independently of the die size of saiddie-strip; receiving data identifying said die size of said die-stripand storing said die size into a database; using a computer controlsystem to access said database to obtain said die-size; and based onsaid die size, cutting said die-strip into individual devices.
 11. Amethod as described in claim 10 further comprising sorting saidindividual devices, wherein said sorting is dependent on said die size.12. A method as described in claim 10 wherein said processes of saidfront-of-line portion, said mold process and said ball attachmentprocess are integrated in-line processes of said back-end manufacturingprocess.
 13. A method as described in claim 12 wherein said ballattachment process is utilized on both plastic and copper.
 14. A methodas described in claim 10 wherein said cutting is performed using anintegrated in-line sawing process of said end-of-line portion.
 15. Amethod as described in claim 10 wherein said front-of-line portioncomprises an in-line die-attachment process; an in-line cure process; afirst in-line plamsa process; an in-line bond process; and a secondin-line plasma process and wherein said traversing comprises: processingsaid die-strip through said in-line die-attachment process thatfunctions independently of said die size; processing said die-stripthrough said in-line cure process that functions independently of saiddie size; processing said die-strip through said first in-line plasmaprocess that functions independently of said die size; processing saiddie-strip through said in-line bond process that functions independentlyof said die size; and processing said die-strip through said secondin-line plasma process that functions independently of said die size.16. A method as described in claim 10 further comprising traversing saidindividual devices through a test process and finish assembly processeswhich produce taped and reeled products.